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STK14C88
32Kx8 AutoStore nvSRAM FEATURES
* 25, 35, 45 ns Read Access & R/W Cycle Time * Unlimited Read/Write Endurance * Automatic Non-volatile STORE on Power Loss * Non-Volatile STORE Under Hardware or Software Control * Automatic RECALL to SRAM on Power Up * Unlimited RECALL Cycles * 1 Million STORE Cycles * 100-Year Non-volatile Data Retention * Single 5V 10% Power Supply * Commercial, Industrial, Military Temperatures * 32-Pin 300 mil SOIC (RoHS-Compliant) * 32-pin CDIP and LCC Packages
DESCRIPTION
The Simtek STK14C88 is a 256Kb fast static RAM with a non-volatile Quantum Trap storage element included with each memory cell. The SRAM provides the fast access & cycle times, ease of use and unlimited read & write endurance of a normal SRAM. Data transfers automatically to the non-volatile storage cells when power loss is detected (the STORE operation). On power up, data is automatically restored to the SRAM (the RECALL operation). Both STORE and RECALL operations are also available under software control. The Simtek nvSRAM is the first monolithic non-volatile memory to offer unlimited writes and reads. It is the highest performance, most reliable non-volatile memory available.
BLOCK DIAGRAM
VCCX Quantum Trap 512 x 512 VCAP
A5 A6 A7 A8 A9 A11 A12 A13 A14
DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7
POWER CONTROL
ROW DECODER
STORE STATIC RAM ARRAY 512 x 512 RECALL STORE/ RECALL CONTROL HSB
INPUT BUFFERS
COLUMN I/O COLUMN DEC
SOFTWARE DETECT
A0 - A13
A0 A1 A2 A3 A4 A10
G E W
This product conforms to specifications per the terms of Simtek standard warranty. The product has completed Simtek internal qualification testing and has reached production status.
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Document Control #ML0014 Rev 0.3 February 2007
STK14C88
PIN CONFIGURATIONS
VCAP A14 A12 A7 A6 A5 A4 A3 NC A2 A1 A0 DQ0 DQ1 DQ2 VSS
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
VCCX HSB W A13 A8 A9 A11 G NC A10 E DQ7 DQ6 DQ5 DQ4 DQ3
32-Pin 450 mil LCC
32-Pin 300 mil SOIC 32-Pin 300 mil CDIP
PIN DESCRIPTIONS
Pin Name A14-A0 DQ7-DQ0 E W G VCCX HSB Input I/O Input Input Input Power Supply I/O I/O Description Address: The 15 address inputs select one of 32,768 bytes in the nvSRAM array Data: Bi-directional 8-bit data bus for accessing the nvSRAM Chip Enable: The active low E input selects the device Write Enable: The active low W enables data on the DQ pins to be written to the address location latched by the falling edge of E Output Enable: The active low G input enables the data output buffers during read cycles. De-asserting G high caused the DQ pins to tri-state. Power: 5.0V, 10% Hardware Store Busy: When low this output indicates a Store is in progress. When pulled low external to the chip, it will initiate a nonvolatile STORE operation. A weak pull up resistor keeps this pin high if not connected. (Connection Optional). AutoStore Capacitor: Supplies power to nvSRAM during power loss to store data from SRAM to nonvolatile storage elements. Ground
VCAP VSS
Power Supply Power Supply
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STK14C88
ABSOLUTE MAXIMUM RATINGSa
Voltage on Input Relative to Ground . . . . . . . . . . . . . -0.5V to 7.0V Voltage on Input Relative to VSS . . . . . . . . . .-0.6V to (VCC + 0.5V) Voltage on DQ0-7 or HSB . . . . . . . . . . . . . . . .-0.5V to (VCC + 0.5V) Temperature under Bias. . . . . . . . . . . . . . . . . . . . . .-55C to 125C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65C to 150C Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1W DC Output Current (1 output at a time, 1s duration) . . . . . . . 15mA
Note a: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
DC CHARACTERISTICS
COMMERCIAL SYMBOL ICC1b PARAMETER MIN Average VCC Current MAX 97 80 70 3 10 2 30 25 22 1.5 1 5 2.2 VSS - .5 2.4 0.4 0.4 0 70 - 40/-55 VCC + .5 0.8 2.2 VSS - .5 2.4 0.4 0.4 85/125 INDUSTRIAL/ Military MIN MAX 100 85 70 3 10 2 31 26 23 1.5 1 5 VCC + .5 0.8 mA mA mA mA mA mA mA mA mA mA A A V V V V V C UNITS
(VCC = 5.0V 10%)e
NOTES
tAVAV = 25ns tAVAV = 35ns tAVAV = 45ns All Inputs Don't Care, VCC = max W (V CC - 0.2V) All Others Cycling, CMOS Levels All Inputs Don't Care tAVAV = 25ns, E VIH tAVAV = 35ns, E VIH tAVAV = 45ns, E VIH E (V CC - 0.2V) All Others VIN 0.2V or (VCC - 0.2V) VCC = max VIN = VSS to VCC VCC = max VIN = VSS to VCC, E or G VIH All Inputs All Inputs IOUT = - 4mA except HSB IOUT = 8mA except HSB IOUT = 3mA
ICC2c ICC3
b
Average VCC Current during STORE Average VCC Current at tAVAV = 200ns 5V, 25C, Typical Average VCAP Current during AutoStore Cycle Average VCC Current (Standby, Cycling TTL Input Levels) VCC Standby Current (Standby, Stable CMOS Input Levels) Input Leakage Current Off-State Output Leakage Current Input Logic "1" Voltage Input Logic "0" Voltage Output Logic "1" Voltage Output Logic "0" Voltage Logic "0" Voltage on HSB Output Operating Temperature
ICC4c ISB1d
ISB2d IILK IOLK VIH VIL VOH VOL VBL TA
Note b: Note c: Note d: Note e:
ICC1 and ICC3 are dependent on output loading and cycle rate. The specified values are obtained with outputs unloaded. ICC2 and ICC4 are the average currents required for the duration of the respective STORE cycles (tSTORE ) . E VIH will not produce standby current levels until any nonvolatile cycle in progress has timed out. VCC reference levels throughout this datasheet refer to VCCX if that is where the power supply connection is made, or VCAP if VCCX is connected to ground.
AC TEST CONDITIONS
Input Pulse Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0V to 3V Input Rise and Fall Times. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5ns Input and Output Timing Reference Levels . . . . . . . . . . . . . . . 1.5V Output Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Figure 1
5.0V
480 Ohms OUTPUT 255 Ohms 30 pF INCLUDING SCOPE AND FIXTURE
CAPACITANCE
SYMBOL CIN COUT
f
(TA = 25C, f = 1.0MHz)
MAX 5 7 UNITS pF pF CONDITIONS V = 0 to 3V V = 0 to 3V
PARAMETER Input Capacitance Output Capacitance
Note f:
These parameters are guaranteed but not tested.
Figure 1: AC Output Loading
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STK14C88
SRAM READ CYCLES #1 & #2
SYMBOLS NO. #1, #2 1 2 3 4 5 6 7 8 9 10 11 tELQV tAVAV
g
(VCC = 5.0V 10%)e
STK14C88-25 PARAMETER STK14C88-35 MIN MAX 35 35 25 10 5 5 10 0 10 0 25 0 35 0 13 0 45 5 5 13 0 15 35 15 5 5 15 45 45 20 STK14C88-45 UNITS MIN MAX 25 25 MIN MAX 45 ns ns ns ns ns ns ns ns ns ns ns
Alt. tACS tRC tAA tOE tOH tLZ tHZ tOLZ tOHZ tPA tPS Chip Enable Access Time Read Cycle Time Address Access Time Output Enable to Data Valid Output Hold after Address Change Chip Enable to Output Active Chip Disable to Output Inactive Output Enable to Output Active Output Disable to Output Inactive Chip Enable to Power Active Chip Disable to Power Standby
tAVQVh tGLQV tAXQXh tELQX tEHQZi tGLQX tGHQZi tELICCHf tEHICCLf
Note g: W and HSB must be high during SRAM READ cycles and low during SRAM WRITE cycles. Note h: I/O state assumes E and G < VIL and W > VIH; device is continuously selected. Note i: Measured 200mV from steady state output voltage.
SRAM READ CYCLE #1: Address Controlledg, h
2 tAVAV ADDRESS 5 tAXQX DQ (DATA OUT)
DATA VALID
3 tAVQV
SRAM READ CYCLE #2: E Controlledg
2 tAVAV ADDRESS 6 tELQX 7 tEHQZ 1 tELQV 11 tEHICCL
E
G 8 tGLQX DQ (DATA OUT) 10 tELICCH
ACTIVE
4 tGLQV
9 tGHQZ
DATA VALID
ICC
STANDBY
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STK14C88
SRAM WRITE CYCLES #1 & #2
SYMBOLS NO. #1 12 13 14 15 16 17 18 19 20 21 tAVAV tWLWH tELWH tDVWH tWHDX tAVWH tAVWL tWHAX t WLQZ
i, j
(VCC = 5.0V 10%)e
STK14C88-25 PARAMETER STK14C88-35 MIN 35 25 25 12 0 25 0 0 10 5 5 13 5 MAX STK14C88-45 UNITS MIN MAX MIN 45 30 30 15 0 30 0 0 15 MAX ns ns ns ns ns ns ns ns ns ns 25 20 20 10 0 20 0 0
#2 tAVAV tWLEH tELEH tDVEH tEHDX tAVEH tAVEL tEHAX
Alt. tWC tWP tCW tDW tDH tAW tAS tWR tWZ tOW Write Cycle Time Write Pulse Width Chip Enable to End of Write Data Set-up to End of Write Data Hold after End of Write Address Set-up to End of Write Address Set-up to Start of Write Address Hold after End of Write Write Enable to Output Disable Output Active after End of Write
tWHQX
Note j: If W is low when E goes low, the outputs remain in the high-impedance state. Note k: E or W must be VIH during address transitions. Note l: HSB must be high during SRAM WRITE cycles.
SRAM WRITE CYCLE #1: W Controlledk, l
12 tAVAV ADDRESS 14 tELWH E 17 tAVWH 13 tWLWH 15 tDVWH DATA IN 20 tWLQZ DATA OUT
PREVIOUS DATA HIGH IMPEDANCE DATA VALID
19 tWHAX
18 tAVWL W
16 tWHDX
21 tWHQX
SRAM WRITE CYCLE #2: E Controlledk, l
12 tAVAV ADDRESS 18 tAVEL E 14 tELEH 19 tEHAX
17 tAVEH W
13 tWLEH 15 tDVEH 16 tEHDX
DATA VALID HIGH IMPEDANCE
DATA IN DATA OUT
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STK14C88
HARDWARE MODE SELECTION
E H L L X W X H L X HSB H H H L A13 - A0 (hex) X X X X Not Selected Read SRAM Write SRAM Nonvolatile STORE MODE I/O Output High Z Output Data Input Data Output High Z POWER Standby Active Active lCC2 m t NOTES
Note m: HSB STORE operation occurs only if an SRAM WRITE has been done since the last nonvolatile cycle. After the STORE (if any) completes, the part will go into standby mode, inhibiting all operations until HSB rises.
HARDWARE STORE CYCLE
SYMBOLS NO. Standard 22 23 24 25 26 tSTORE tDELAY tRECOVER tHLHX tHLBL Alternate tHLHZ tHLQZ tHHQX STORE Cycle Duration Time Allowed to Complete SRAM Cycle Hardware STORE High to Inhibit Off Hardware STORE Pulse Width Hardware STORE Low to STORE Busy PARAMETER
(VCC = 5.0V 10%)e
STK14C88 UNITS MIN MAX 10 1 700 15 300 ms s ns ns ns i, n i, n n, o NOTES
Note n: E and G low and W high for output behavior. Note o: tRECOVER is only applicable after tSTORE is complete.
HARDWARE STORE CYCLE
25 tHLHX HSB (IN) 24 tRECOVER 22 tSTORE
HSB (OUT)
HIGH IMPEDANCE
26 tHLBL
HIGH IMPEDANCE
23 tDELAY DQ (DATA OUT)
DATA VALID DATA VALID
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STK14C88
AutoStore/POWER-UP RECALL
SYMBOLS NO. Standard 27 28 29 30 31 32 tRESTORE tSTORE tVSBL tDELAY VSWITCH VRESET tBLQZ tHLHZ Alternate Power-up RECALL Duration STORE Cycle Duration Low Voltage Trigger (VSWITCH) to HSB Low Time Allowed to Complete SRAM Cycle Low Voltage Trigger Level Low Voltage Reset Level 1 4.0 4.5 3.6 PARAMETER MIN MAX 550 10 300 s ms ns s V V p n, q l n
(VCC = 5.0V 10%)e
STK14C88 UNITS NOTES
Note p: tRESTORE starts from the time VCC rises above VSWITCH. Note q: HSB is asserted low for 1s when VCAP drops through VSWITCH. If an SRAM WRITE has not taken place since the last nonvolatile cycle, HSB will be released and no STORE will take place.
AutoStore/POWER-UP RECALL
VCC 31 VSWITCH 32 VRESET
AutoStore
POWER-UP RECALL 27 tRESTORE HSB 30 tDELAY W 29 tVSBL 28 tSTORE
DQ (DATA OUT)
POWER-UP RECALL
BROWN OUT NO STORE (NO SRAM WRITES) NO RECALL (VCC DID NOT GO BELOW VRESET)
BROWN OUT AutoStore NO RECALL (VCC DID NOT GO BELOW VRESET)
BROWN OUT AutoStore RECALL WHEN VCC RETURNS ABOVE VSWITCH
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STK14C88
SOFTWARE STORE/RECALL MODE SELECTION
E W A13 - A0 (hex) 0E38 31C7 03E0 3C1F 303F 0FC0 0E38 31C7 03E0 3C1F 303F 0C63 MODE Read SRAM Read SRAM Read SRAM Read SRAM Read SRAM Nonvolatile STORE Read SRAM Read SRAM Read SRAM Read SRAM Read SRAM Nonvolatile RECALL I/O Output Data Output Data Output Data Output Data Output Data Output High Z Output Data Output Data Output Data Output Data Output Data Output High Z POWER NOTES
L
H
Active
r, s, t
lCC2
L
H
Active
r, s, t
SOFTWARE-CONTROLLED STORE/RECALL CYCLEv
SYMBOLS NO. Standard 33 34 35 36 37 tAVAV tAVEL tELEH tELAX tRECALL Alternate tRC tAS tCW STORE/RECALL Initiation Cycle Time Address Set-up Time Clock Pulse Width Address Hold Time RECALL Duration PARAMETER MIN 25 0 20 20 20 MAX MIN 35 0 25 20 20 STK14C88-25
(VCC = 5.0V 10%)e
STK14C88-35 MAX STK14C88-45 UNITS NOTES MIN 45 0 30 20 20 MAX ns ns ns ns s n u u u
Note r: Note s: Note t: Note u: Note v:
The six consecutive addresses must be in the order listed. W must be high during all six consecutive cycles to enable a nonvolatile cycle. While there are 15 addresses on the STK14C88, only the lower 14 are used to control software modes. I/O state assumes G < VIL. Activation of nonvolatile cycles does not depend on state of G. The software sequence is clocked with E controlled READs. The six consecutive addresses must be in the order listed in the Hardware Mode Selection Table: (0E38, 31C7, 03E0, 3C1F, 303F, 0FC0) for a STORE cycle or (0E38, 31C7, 03E0, 3C1F, 303F, 0C63) for a RECALL cycle. W must be high during all six consecutive cycles.
SOFTWARE STORE/RECALL CYCLE: E CONTROLLEDv
tAVAV ADDRESS
34 ADDRESS #1 33
tAVAV
ADDRESS #6
33
tAVEL E
tELEH
35
tELAX
28 37 / tRECALL
36
tSTORE DQ (DATA
DATA VALID DATA VALID
HIGH IMPEDANCE
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STK14C88 nvSRAM OPERATION
The STK14C88 has two separate modes of operation: SRAM mode and nonvolatile mode. In SRAM mode, the memory operates as a standard fast static RAM. In nonvolatile mode, data is transferred from SRAM to nonvolatile elements (the STORE operation) or from nonvolatile elements to SRAM (the RECALL operation). In this mode SRAM functions are disabled.
POWER-UP RECALL
During power up, or after any low-power condition (VCAP < VRESET), an internal RECALL request will be latched. When VCAP once again exceeds the sense voltage of VSWITCH, a RECALL cycle will automatically be initiated and will take tRESTORE to complete. If the STK14C88 is in a WRITE state at the end of power-up RECALL, the SRAM data will be corrupted. To help avoid this situation, a 10K Ohm resistor should be connected either between W and system VCC or between E and system VCC.
NOISE CONSIDERATIONS
The STK14C88 is a high-speed memory and so must have a high-frequency bypass capacitor of approximately 0.1F connected between VCAP and VSS, using leads and traces that are as short as possible. As with all high-speed CMOS ICs, normal careful routing of power, ground and signals will help prevent noise problems.
SOFTWARE NONVOLATILE STORE
The STK14C88 software STORE cycle is initiated by executing sequential E controlled READ cycles from six specific address locations. During the STORE cycle an erase of the previous nonvolatile data is first performed, followed by a program of the nonvolatile elements. The program operation copies the SRAM data into nonvolatile memory. Once a STORE cycle is initiated, further input and output are disabled until the cycle is completed. Because a sequence of READs from specific addresses is used for STORE initiation, it is important that no other READ or WRITE accesses intervene in the sequence, or the sequence will be aborted and no STORE or RECALL will take place. To initiate the software STORE cycle, the following READ sequence must be performed:
1. 2. 3. 4. 5. 6. Read address Read address Read address Read address Read address Read address 0E38 (hex) 31C7 (hex) 03E0 (hex) 3C1F (hex) 303F (hex) 0FC0 (hex) Valid READ Valid READ Valid READ Valid READ Valid READ Initiate STORE cycle
SRAM READ
The STK14C88 performs a READ cycle whenever E and G are low and W and HSB are high. The address specified on pins A0-14 determines which of the 32,768 data bytes will be accessed. When the READ is initiated by an address transition, the outputs will be valid after a delay of tAVQV (READ cycle #1). If the READ is initiated by E or G, the outputs will be valid at tELQV or at tGLQV, whichever is later (READ cycle #2). The data outputs will repeatedly respond to address changes within the tAVQV access time without the need for transitions on any control input pins, and will remain valid until another address change or until E or G is brought high, or W or HSB is brought low.
SRAM WRITE
A WRITE cycle is performed whenever E and W are low and HSB is high. The address inputs must be stable prior to entering the WRITE cycle and must remain stable until either E or W goes high at the end of the cycle. The data on the common I/O pins DQ0-7 will be written into the memory if it is valid tDVWH before the end of a W controlled WRITE or tDVEH before the end of an E controlled WRITE. It is recommended that G be kept high during the entire WRITE cycle to avoid data bus contention on common I/O lines. If G is left low, internal circuitry will turn off the output buffers tWLQZ after W goes low.
The software sequence must be clocked with E controlled READs. Once the sixth address in the sequence has been entered, the STORE cycle will commence and the chip will be disabled. It is important that READ cycles and not WRITE cycles be used in the sequence, although it is not necessary that G be low for the sequence to be valid. After the tSTORE cycle time has been fulfilled, the SRAM will again be activated for READ and WRITE operation.
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STK14C88
SOFTWARE NONVOLATILE RECALL
A software RECALL cycle is initiated with a sequence of READ operations in a manner similar to the software STORE initiation. To initiate the RECALL cycle, the following sequence of E controlled READ operations must be performed:
1. 2. 3. 4. 5. 6. Read address Read address Read address Read address Read address Read address 0E38 (hex) 31C7 (hex) 03E0 (hex) 3C1F (hex) 303F (hex) 0C63 (hex) Valid READ Valid READ Valid READ Valid READ Valid READ Initiate RECALL cycle
Figure 2 shows the proper connection of capacitors for automatic store operation. A charge storage capacitor having a capacity of between 68F and 220F ( 20%) rated at 6V should be provided. In system power mode (Figure 3), both VCCX and VCAP are connected to the + 5V power supply without the 68F capacitor. In this mode the AutoStore function of the STK14C88 will operate on the stored system charge as power goes down. The user must, however, guarantee that VCCX does not drop below 3.6V during the 10ms STORE cycle. If an automatic STORE on power loss is not required, then VCCX can be tied to ground and + 5V applied to VCAP (Figure 4). This is the AutoStore Inhibit mode, in which the AutoStore function is disabled. If the STK14C88 is operated in this configuration, references to VCCX should be changed to VCAP throughout this data sheet. In this mode, STORE operations may be triggered through software control or the HSB pin. It is not permissable to change between these three options "on the fly". In order to prevent unneeded STORE operations, automatic STOREs as well as those initiated by externally driving HSB low will be ignored unless at least one WRITE operation has taken place since the most recent STORE or RECALL cycle. Softwareinitiated STORE cycles are performed regardless of whether a WRITE operation has taken place. If the power supply drops faster than 20 s/volt before VCCX reaches VSWITCH, then a 2.2 ohm resistor should be inserted between VCCX and the system supply to avoid momentary excess of current between Vccx and Vcap.
10k 0.1F Bypass 10k
1 32 31 30 16 17
Internally, RECALL is a two-step procedure. First, the SRAM data is cleared, and second, the nonvolatile information is transferred into the SRAM cells. After the tRECALL cycle time the SRAM will once again be ready for READ and WRITE operations. The RECALL operation in no way alters the data in the nonvolatile elements. The nonvolatile data can be recalled an unlimited number of times.
AutoStore OPERATION
The STK14C88 can be powered in one of three modes. During normal AutoStore operation, the STK14C88 will draw current from VCCX to charge a capacitor connected to the VCAP pin. This stored charge will be used by the chip to perform a single STORE operation. After power up, when the voltage on the VCAP pin drops below VSWITCH, the part will automatically disconnect the VCAP pin from VCCX and initiate a STORE operation.
10k 10k
1 32 31 30
10k
1
32 31 30
68F 6v, 20%
+
0.1F Bypass
0.1F Bypass
16 16 17
17
Figure 2: AutoStore Mode
Figure 3: System Power Mode
Figure 4: AutoStore Inhibit Mode
*If HSB is not used, it should be left unconnected.
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10k
STK14C88
HSB OPERATION
The STK14C88 provides the HSB pin for controlling and acknowledging the STORE operations. The HSB pin can be used to request a hardware STORE cycle. When the HSB pin is driven low, the STK14C88 will conditionally initiate a STORE operation after tDELAY; an actual STORE cycle will only begin if a WRITE to the SRAM took place since the last STORE or RECALL cycle. The HSB pin also acts as an open drain driver that is internally driven low to indicate a busy condition while the STORE (initiated by any means) is in progress. Pull up this pin with an external 10K ohm resistor to VCAP if HSB is used as a driver.
SRAM READ and WRITE operations that are in
PREVENTING STORES
The STORE function can be disabled on the fly by holding HSB high with a driver capable of sourcing 30mA at a VOH of at least 2.2V, as it will have to overpower the internal pull-down device that drives HSB low for 20s at the onset of a STORE. When the STK14C88 is connected for AutoStore operation (system VCC connected to VCCX and a 68F capacitor on VCAP) and VCC crosses VSWITCH on the way down, the STK14C88 will attempt to pull HSB low; if HSB doesn't actually get below VIL, the part will stop trying to pull HSB low and abort the STORE attempt.
HARDWARE PROTECT
The STK14C88 offers hardware protection against inadvertent STORE operation and SRAM WRITEs during low-voltage conditions. When VCAP < VSWITCH, all externally initiated STORE operations and SRAM WRITEs will be inhibited. AutoStore can be completely disabled by tying VCCX to ground and applying + 5V to VCAP. This is the AutoStore Inhibit mode; in this mode STOREs are only initiated by explicit request using either the software sequence or the HSB pin.
progress when HSB is driven low by any means are given time to complete before the STORE operation is initiated. After HSB goes low, the STK14C88 will continue SRAM operations for tDELAY. During tDELAY, multiple SRAM READ operations may take place. If a WRITE is in progress when HSB is pulled low it will be allowed a time, tDELAY, to complete. However, any SRAM WRITE cycles requested after HSB goes low will be inhibited until HSB returns high. The HSB pin can be used to synchronize multiple STK14C88s while using a single larger capacitor. To operate in this mode the HSB pin should be connected together to the HSB pins from the other STK14C88s. An external pull-up resistor to + 5V is required since HSB acts as an open drain pull down. The VCAP pins from the other STK14C88 parts can be tied together and share a single capacitor. The capacitor size must be scaled by the number of devices connected to it. When any one of the STK14C88s detects a power loss and asserts HSB, the common HSB pin will cause all parts to request a STORE cycle (a STORE will take place in those STK14C88s that have been written since the last nonvolatile cycle). During any STORE operation, regardless of how it was initiated, the STK14C88 will continue to drive the HSB pin low, releasing it only when the STORE is complete. Upon completion of the STORE operation the STK14C88 will remain disabled until the HSB pin returns high. If HSB is not used, it should be left unconnected.
LOW AVERAGE ACTIVE POWER
The STK14C88 draws significantly less current when it is cycled at times longer than 50ns. Figure 5 shows the relationship between ICC and READ cycle time. Worst-case current consumption is shown for both CMOS and TTL input levels (commercial temperature range, VCC = 5.5V, 100% duty cycle on chip enable). Figure 6 shows the same relationship for WRITE cycles. If the chip enable duty cycle is less than 100%, only standby current is drawn when the chip is disabled. The overall average current drawn by the STK14C88 depends on the following items: 1) CMOS vs. TTL input levels; 2) the duty cycle of chip enable; 3) the overall cycle rate for accesses; 4) the ratio of READs to WRITEs; 5) the operating temperature; 6) the Vcc level; and 7) I/O loading.
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STK14C88
100 100
Average Active Current (mA)
80
Average Active Current (mA)
80
60
60 TTL CMOS 20
40 TTL 20 CMOS 0 50 100 150 Cycle Time (ns) 200
40
0 50 100 150 Cycle Time (ns) 200
Figure 5: Icc (max) Reads
Figure 6: Icc (max) Writes
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STK14C88
Commercial and Industrial Ordering Information
STK14C88 - N F 45 I TR Packaging Option
Blank = Tube TR = Tape and Reel
Temperature Range
Blank = Commercial (0 to 70C) I = Industrial (-40 to 85C)
Access Time
25 = 25ns 35 = 35ns 45 = 45ns
Lead Finish
F = 100% Sn (Matte Tin)
Package
N = Plastic 32-pin 300 mil SOIC C = Ceramic 32-pin 300 mil CDIP L = Ceramic 32-pad LCC
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STK14C88
Military Ordering Information
STK14C88 - 5 C 45 M Temperature Range
M = Military (-55 to 125C)
Access Time
35 = 35ns 45 = 45ns
Package
L=Ceramic 32-pad LCC C=Ceramic 32-pin 300 mil CDIP K=Ceramic 32-pin 300 mil CDIP with solder dip finish
Retention / Endurance
5 = Military (10 years or 105cycles)
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STK14C88
Ordering Information
Part Number STK14C88-NF25 STK14C88-NF35 STK14C88-NF45 STK14C88-NF25TR STK14C88-NF35TR STK14C88-NF45TR STK14C88-NF25I STK14C88-NF35I STK14C88-NF45I STK14C88-NF25ITR STK14C88-NF35ITR STK14C88-NF45ITR STK14C88-C45I STK14C88-L45I STK14C88-5L35M STK14C88-5L45M STK14C88-5C35M STK14C88-5C45M STK14C88-5K35M STK14C88-5K45M Description 5V 32Kx8 AutoStore nvSRAM SOP32-300 5V 32Kx8 AutoStore nvSRAM SOP32-300 5V 32Kx8 AutoStore nvSRAM SOP32-300 5V 32Kx8 AutoStore nvSRAM SOP32-300 5V 32Kx8 AutoStore nvSRAM SOP32-300 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 5V 32Kx8 32Kx8 32Kx8 32Kx8 32Kx8 32Kx8 32Kx8 32Kx8 32Kx8 32Kx8 32Kx8 32Kx8 32Kx8 32Kx8 32Kx8 AutoStore AutoStore AutoStore AutoStore AutoStore AutoStore AutoStore AutoStore AutoStore AutoStore AutoStore AutoStore AutoStore AutoStore AutoStore nvSRAM nvSRAM nvSRAM nvSRAM nvSRAM nvSRAM nvSRAM nvSRAM nvSRAM nvSRAM nvSRAM nvSRAM nvSRAM nvSRAM nvSRAM SOP32-300 SOP32-300 SOP32-300 SOP32-300 SOP32-300 SOP32-300 SOP32-300 CDIP32-300 LCC32-450 LCC32-450 LCC32-450 CDIP32-300 CDIP32-300 CDIP32-300 CDIP32-300 Temperature Commercial Commercial Commercial Commercial Commercial Commercial Industrial Industrial Industrial Industrial Industrial Industrial Industrial Industrial Military Military Military Military Military Military
Document Control #ML0014 Rev 0.3 February 2007
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STK14C88 Package Diagrams
32 Lead 300 mil SOIC Gull Wing
0.292 7.42 0.300 7.60
(
)
0.405 10.29 0.419 10.64
(
)
Pin 1 Index
.050 (1.27)
0.810 20.57 0.822 20.88
(
)
BSC
0.026 0.66 0.032 0.81
(
)
0.090 2.29 0.100 2.54
()
0.086 0.090 2.18 ( 2.29)
0.12 0.22 0.004 0.10 0.010 0.25
0.014 0.36 0.020 0.51
()
()
0.006 0.013
()
0.021 0.041
0.15 0.32
0 8 0.53 ( 1.04 )
o o
DIM = INCHES DIM = mm
MIN MAX
MIN ( MAX )
Document Control #ML0014 Rev 0.3 February, 2007
16
STK14C88
32 Lead 300 mil Side Braze DIL
1.585 1.615
(40.25) 41.02
.280 .310
( 7.36 ) 7.87
Pin 1 Index
----.060 1.52
()
PIN 16
.124 3.15 .162 4.12
()
.125 (3.18) MIN
()
.040 .060 1.02 1.52
.016 .020
()
0.41 0.51 .290 .310
.048 .052
()
1.22 1.32
.090 .110
( 2.29 ) 2.79
( 7.37 ) 7.87
.009 .012
( 0.23 ) 0.30
.300 .320
( 7.62 ) 8.13
MIN MAX
DIM = INCHES DIM = mm
MIN ( MAX )
Document Control #ML0014 Rev 0.3 February 2007
17
STK14C88
32 Lead 450 mil Ceramic LCC
.080.008 .060.006 .550.005 .020.002 .020.002 (.040) (.020X2)
.360.006
Pad 1
C.020.010
C.040.010 .002
TYP .050.005
.450-.010 +.005 (R.009)
(C.004) .350-.010 +.005 Pad 1 Index .300 [P=.050X6] .050 Pad 32
NOTES: 1. GOLD PLATE 85~220 INCHES OVER 50~350 INCHES NICKEL. 2. PADS "A" AND "B" ELECTRICALLY CONNECTED TO THE DIE ATTACH PAD. 3. SEAL RING TO BE ELECTRICALLY ISOLATED FROM ALL LEADS. 4. LEAD RESISTANCE : 800m MAX. 5. LEAD TO LEAD CAPACITANCE NOT TO EXCEED 3pf (1MHz). 6. BLACK ALUMINA CERAMIC.
.085.008 .025.003
.400 [P=.050X8]
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TYP .050.005
.050
.450.005
.310.006
Pad 32
M 15 .0 IN
STK14C88
Document Revision History
Revision 0.0 0.1 0.2 0.3
Date December 2002 September 2003 March 2003 February 2007
Summary Removed 20 nsec device; Combined commercial, industrial and military; current limit resistor added for extreme power-off slew rate. Added lead-free lead finish Removed Commercial/Industrial Leaded Lead Finish, Removed "W" DIP package Add Tape Reel Ordering Options Add Product Ordering Code Listing Add Package Drawings Reformat Entire Document
SIMTEK STK14C88 Datasheet, February 2007 Copyright 2007, Simtek Corporation. All rights reserved. This datasheet may only be printed for the expressed use of Simtek Customers. No part of the datasheet may be reproduced in any other form or means without the express written permission from Simtek Corporation. The information contained in this publication is believed to be accurate, but changes may be made without notice. Simtek does not assume responsibility for, or grant or imply any warranty, including MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE regarding this information, the product or its use. Nothing herein constitutes a license, grant or transfer of any rights to any Simtek patent, copyright, trademark, or other proprietary right.
Document Control #ML0014 Rev 0.3 February 2007
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